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SZMM3Z3V9ST1G - onsemi

Description: Standard Zener Breakdown Voltage Range - 2.4 V to 75 V; Steady State Power Rating of 300 mW; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics:; Tight Tolerance ; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; FLAMMABILITY RATING: UL94 V-0; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; AEC-Q101 Qualified and PPAP Capable ; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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PCB Footprints
SZMM3Z3V9ST1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323
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3D Models
SZMM3Z3V9ST1G - onsemi  - 3D model - Small Outline Diode - SOD-323
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SZMM3Z3V9ST1G Details

  • Manufacturer Part Number:

    SZMM3Z3V9ST1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.9 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    3.35%

  • Working Test Current:

    5 mA

SZMM3Z3V9ST1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure good thermal design, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation.
  • The maximum surge current rating for the SZMM3Z3V9ST1G is not explicitly stated in the datasheet. However, it's generally recommended to limit surge currents to 2-3 times the maximum average current rating to prevent damage. In this case, the maximum average current rating is 3A, so the surge current should be limited to around 6-9A.
  • While the SZMM3Z3V9ST1G is a high-speed switching diode, its frequency response is not explicitly stated in the datasheet. However, based on its construction and similar devices, it's suitable for high-frequency switching applications up to several hundred kHz. For higher frequencies, consider using a dedicated high-frequency diode or consulting with an onsemi application engineer.
  • The SZMM3Z3V9ST1G has an internal ESD protection diode, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.

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