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SZMM5Z4689T1G - onsemi

Description: Wide Zener Breakdown Voltage Range - 1.8 V to 43 V; Small Body Outline Dimensions: 1.20 mm X 0.6 mm; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Low Reverse Current (IZT) - 50µA

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PCB Footprints
SZMM5Z4689T1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SZMM5Z4689T1G*
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SZMM5Z4689T1G - onsemi  - 3D model - Small Outline Diode Flat Lead - SZMM5Z4689T1G*
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SZMM5Z4689T1G Details

  • Manufacturer Part Number:

    SZMM5Z4689T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523-2

  • Manufacturer Package Code:

    502-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    5.1 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    0.05 mA

SZMM5Z4689T1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, using thermal vias and a solid ground plane can also improve thermal performance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and avoid thermal hotspots.
  • The SZMM5Z4689T1G has built-in ESD protection, but it's still important to follow proper handling and storage precautions to prevent damage. Use an anti-static wrist strap, mat, or packaging materials, and avoid touching the device's pins or exposed die. Ground the device to a common point during handling and assembly.
  • The SZMM5Z4689T1G is a commercial-grade device, but onsemi offers other versions with enhanced reliability and automotive-grade options. For high-reliability or automotive applications, consider using the SZMM5Z4689T1G-HR or SZMM5Z4689T1G-AEC, which have undergone additional testing and qualification.
  • To troubleshoot and debug issues with the SZMM5Z4689T1G, start by reviewing the datasheet and application notes. Check the device's pinout, voltage, and current ratings. Use oscilloscopes, logic analyzers, or other diagnostic tools to identify the issue. Consult onsemi's technical support resources, such as application notes, FAQs, and forums, for guidance and potential solutions.

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SZMM5Z4689T1G Overview

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