Description:Standard Zener Breakdown Voltage Range: 2.4V to 75V; Steady State Power Rating of 500mW; Small Body Outline Dimensions: 0.047in x 0.032in (1.20mm x 0.80mm); Low Body Height: 0.028in (0.7mm); ESD Rating of Class 3 (>16kV) Human Body Model; Epoxy Meets UL94, VO; Cathode Indicated by Polarity Band; Lead Finish: 100% Matte Sn (Tin); Qualified Maximum Reflow Temperature: 260C; Device Meets MSL 1 Requirements; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other
The recommended land pattern for the SZMM5Z5V6T1G is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask opening of 0.5 mm x 0.5 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
The SZMM5Z5V6T1G has a thermal resistance of 25°C/W. To handle thermal management, ensure good airflow around the component, use a heat sink if necessary, and avoid blocking the airflow around the component. Also, ensure that the PCB is designed to dissipate heat efficiently.
The maximum operating temperature range for the SZMM5Z5V6T1G is -40°C to 150°C. However, the recommended operating temperature range is -40°C to 125°C for optimal performance and reliability.
To ensure the reliability of the SZMM5Z5V6T1G in high-reliability applications, follow the recommended storage and handling procedures, use a clean and dry environment, and avoid exposing the component to mechanical stress, moisture, or contamination. Also, ensure that the component is soldered correctly and that the PCB is designed to minimize thermal and mechanical stress.
The recommended soldering profile for the SZMM5Z5V6T1G is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to minimize oxidation.
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SZMM5Z5V6T1G Overview
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