Description:500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system to keep the junction temperature below 125°C. Use a heat sink or thermal interface material to improve heat dissipation.
The SZMMSZ4684T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
Yes, the SZMMSZ4684T1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured using a process that is compliant with IATF 16949.
The optimal gate resistor value depends on the specific application and switching frequency. A general guideline is to use a resistor value between 10 ohms and 100 ohms. Consult the application note or contact onsemi support for more detailed guidance.
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SZMMSZ4684T1G Overview
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