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SZMMSZ4686T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

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SZMMSZ4686T1G - onsemi - PCB symbol
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PCB Footprints
SZMMSZ4686T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE 425-04 ISSUE G
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SZMMSZ4686T1G - onsemi - 3D model - Small Outline Diode - SOD-123 CASE 425-04 ISSUE G
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SZMMSZ4686T1G Details

  • Manufacturer Part Number:

    SZMMSZ4686T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.9 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5.13%

  • Working Test Current:

    0.05 mA

SZMMSZ4686T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND9093/D for more details.
  • Ensure proper thermal management, follow the recommended PCB layout, and consider using a thermal interface material (TIM) to minimize thermal resistance. Also, verify that the system's power supply and signal integrity meet the device's requirements.
  • The SZMMSZ4686T1G has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap or mat, and handle the device by the body or pins, avoiding direct contact with the die. Store the device in an anti-static bag or container.
  • Yes, the SZMMSZ4686T1G is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards. Consult onsemi's automotive and high-reliability documentation for more information.
  • Follow the soldering and rework guidelines outlined in onsemi's application note AND9095/D. Use a soldering iron with a temperature range of 350°C to 370°C, and ensure the device is not exposed to temperatures above 260°C for more than 10 seconds.

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SZMMSZ4686T1G Overview

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