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SZMMSZ5264BT1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

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PCB Footprints
SZMMSZ5264BT1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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SZMMSZ5264BT1G - onsemi  - 3D model - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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SZMMSZ5264BT1G Details

  • Manufacturer Part Number:

    SZMMSZ5264BT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    60 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    2.1 mA

SZMMSZ5264BT1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, it's recommended to use a 2-3 layer PCB with a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and avoid thermal hotspots on the PCB.
  • The SZMMSZ5264BT1G has built-in ESD protection, but it's still important to follow proper handling and storage precautions to prevent damage. Use an anti-static wrist strap or mat when handling the device, and store it in an anti-static bag or container. Avoid touching the pins or exposing the device to high-voltage sources.
  • The SZMMSZ5264BT1G is a commercial-grade device, but onsemi does offer automotive-grade and high-reliability versions of similar devices. If you need a device for a high-reliability or automotive application, consider using a device specifically designed and qualified for those markets, such as the AEC-Q101 qualified version.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes to ensure proper usage and configuration. Check the PCB layout and assembly for any errors or defects. Use oscilloscopes or logic analyzers to monitor the device's inputs and outputs. If the issue persists, contact onsemi's technical support for further assistance.

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SZMMSZ5264BT1G Overview

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