SZNSP8814MUTAG footprint, schematic symbol and 3D model by onsemi

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PCB Footprints

SZNSP8814MUTAG - onsemi PCB footprint - Other - Other - UDFN8 2.2x2,0.575P CASE 506CV ISSUE A_2022

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Part Number SZNSP8814MUTAG
Manufacturer onsemi
Pin Count 6
Part Category Diode ESD (Uni-directional)
Package Category Other
Footprint Name Other - UDFN8 2.2x2,0.575P CASE 506CV ISSUE A_2022
Released Date Apr 22, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SZNSP8814MUTAG Details

Manufacturer Part Number:
SZNSP8814MUTAG
Brand Name:
ON Semiconductor
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
UDFN-8
Manufacturer Package Code:
506CV
Country Of Origin:
Thailand
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Manufacturer:
onsemi
YTEOL:
6.44
Additional Feature:
LOW CAPACITANCE
Breakdown Voltage-Max:
5 V
Breakdown Voltage-Min:
3.2 V
Breakdown Voltage-Nom:
3.5 V
Case Connection:
ANODE
Clamping Voltage-Max:
15 V
Configuration:
COMMON ANODE, 4 ELEMENTS, 4 CHANNEL
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
Forward Voltage-Max (VF):
1.1 V
JESD-30 Code:
R-PDSO-N8
Moisture Sensitivity Level:
1
Number of Elements:
4
Number of Terminals:
8
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Reference Standard:
AEC-Q101; IEC-61000-4-2, 4-5
Rep Pk Reverse Voltage-Max:
3 V
Reverse Current-Max:
0.5 µA
Reverse Test Voltage:
3 V
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Finish:
NICKEL PALLADIUM GOLD
Terminal Form:
NO LEAD
Terminal Position:
DUAL

SZNSP8814MUTAG Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials and following proper soldering and assembly techniques.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
To handle ESD protection during handling and assembly, use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins or die, and use ESD-protected packaging and storage materials.
The recommended storage and handling conditions for the SZNSP8814MUTAG include storing the device in a dry, cool place, away from direct sunlight, and handling the device in a clean, ESD-protected environment.

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