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SZNUD4700SNT1G - onsemi

Description: A Simple Two Terminal Device; Automatically Resets Itself if the LED Heals Itself or is Replaced; ON-State Voltage Typically 1 V; OFF-State Current less than 250 µA; This is a Pb-Free Device

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SZNUD4700SNT1G Details

  • Manufacturer Part Number:

    SZNUD4700SNT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    POWERMITE-2

  • Manufacturer Package Code:

    457-04

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Breakover Voltage-Max:

    7.5 V

  • Breakover Voltage-Min:

    5.5 V

  • Case Connection:

    ANODE

  • Configuration:

    COMPLEX

  • DC Off-state Voltage-Max:

    10 V

  • Holding Current-Max:

    12 mA

  • JESD-30 Code:

    R-PSSO-G1

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    1

  • On-State Voltage-Max:

    1.2 V

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    SILICON SURGE PROTECTOR

SZNUD4700SNT1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid copper plane on the top and bottom layers, with multiple vias connecting them to dissipate heat. Additionally, keeping the component away from other heat sources and using a thermal pad or heat sink can improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range and derate the device's power dissipation accordingly. Additionally, using a heat sink or thermal pad, and ensuring good airflow around the device can help to reduce the junction temperature.
  • The SZNUD4700SNT1G has built-in ESD protection, but it's still important to follow standard ESD handling precautions when handling the device, such as using an ESD wrist strap, mat, or workstation, and avoiding touching the device's pins or leads.
  • The SZNUD4700SNT1G is an industrial-grade device, but it may not meet the specific requirements for high-reliability or automotive applications. It's essential to review the device's specifications and certifications (e.g., AEC-Q100) to ensure it meets the requirements of the target application.
  • The recommended soldering and assembly techniques for the SZNUD4700SNT1G include using a soldering iron with a temperature range of 250°C to 260°C, and following the recommended soldering time and flux guidelines. Additionally, using a reflow oven or wave soldering process can help to ensure reliable connections.

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SZNUD4700SNT1G Overview

Use the download button to access the SZNUD4700SNT1G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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