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SZNUP3105LT1G - onsemi

Description: 350 W Peak Power Dissipation per Line (8/20 µs Waveform); Low Reverse Leakage Current (< 100 nA); 30 pF Overall Capacitance with Diode Capacitance Matching; Flammability Rating UL 94 V−0; IEC Compatibility: − IEC 61000−4−2 (ESD): Level 4 − IEC 61000−4−4 (EFT): 50 A – 5/50 ns − IEC 61000−4−5 (Lightning) 8.0 A (8/20 µs); SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR Free an

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PCB Footprints
SZNUP3105LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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3D Models
SZNUP3105LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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SZNUP3105LT1G Details

  • Manufacturer Part Number:

    SZNUP3105LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Package Description:

    TO-236, 3 PIN

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.98

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Min:

    35.6 V

  • Clamping Voltage-Max:

    66 V

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    350 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-5

  • Rep Pk Reverse Voltage-Max:

    32 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    32 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZNUP3105LT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure the input voltage is within the recommended range (4.5V to 5.5V) and the output voltage is set to the desired level (e.g., 3.3V or 1.8V). Also, ensure the input and output capacitors are properly sized and placed close to the device.
  • The maximum output current capability is 1.5A, but it's recommended to derate the output current to 1.2A for optimal reliability and thermal performance.
  • The thermal shutdown feature is enabled when the junction temperature exceeds 150°C. To handle this, ensure proper thermal design, use a heat sink if necessary, and implement a thermal monitoring and shutdown mechanism in your system design.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended, placed as close as possible to the VIN pin. This helps to filter out noise and ensure stable operation.

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