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SZNUP4114HMR6T1G - onsemi

Description: Low Clamping Voltage; Small Body Outline Dimensions on SC88 Package:0.082 x 0.078 (2.10 mm x 1.25 mm); Low Body Height: 0.043 (1.10 mm); Standoff Voltage: 5.5 V; Low Leakage; Response Time is Typically < 1.0 ns; IEC6100042 Level 4 ESD Protection; These Devices are PbFree and are RoHS Compliant; AECQ101 Qualified and PPAP Capable for SZNUP4114; Meets UL 94 V-0; SZ prefix for automotive and other applications requiring unique site and control change requirements

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PCB Footprints
SZNUP4114HMR6T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6
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SZNUP4114HMR6T1G - onsemi  - 3D model - SOT23 (6-Pin) - TSOP-6
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SZNUP4114HMR6T1G Details

  • Manufacturer Part Number:

    SZNUP4114HMR6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-6

  • Package Description:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.81

  • Additional Feature:

    ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Min:

    5.5 V

  • Breakdown Voltage-Nom:

    6.5 V

  • Clamping Voltage-Max:

    10 V

  • Configuration:

    COMPLEX, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    5

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZNUP4114HMR6T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZNUP4114HMR6T1G should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure reliable operation across the full temperature range (-40°C to 150°C), follow the recommended operating conditions, and consider the device's thermal derating. Also, ensure that the PCB design and component selection can withstand the operating temperatures.
  • For the SZNUP4114HMR6T1G, follow the recommended soldering conditions: peak temperature 260°C, time above 217°C 30s, and time above 200°C 60s. Use a soldering iron with a temperature range of 350°C to 400°C.
  • To prevent ESD damage, handle the SZNUP4114HMR6T1G with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the assembly line and storage areas are ESD-protected, and follow proper grounding procedures.
  • Store the SZNUP4114HMR6T1G in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 30°C, with a relative humidity below 60%.

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