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SZP6SMB180AT3G - LITTELFUSE

Description: TVS DIODE 154V 246V SMB

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PCB Footprints
SZP6SMB180AT3G - LITTELFUSE PCB footprint - Diodes Moulded - Diodes Moulded - SMB
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3D Models
SZP6SMB180AT3G - LITTELFUSE  - 3D model - Diodes Moulded - SMB
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SZP6SMB180AT3G Details

  • Manufacturer Part Number:

    SZP6SMB180AT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

  • Breakdown Voltage-Max:

    189 V

  • Breakdown Voltage-Min:

    171 V

  • Breakdown Voltage-Nom:

    180 V

  • Clamping Voltage-Max:

    246 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    154 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    154 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZP6SMB180AT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZP6SMB180AT3G is a standard SMB footprint with a pad size of 1.5mm x 2.5mm and a spacing of 1.3mm between pads.
  • Yes, the SZP6SMB180AT3G is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder to the pads. Avoid applying excessive heat or solder, as this can damage the device.
  • The SZP6SMB180AT3G has a maximum surge current rating of 180A, which is the maximum current it can withstand for a short duration (typically 10/1000μs) without failing.
  • Yes, multiple SZP6SMB180AT3G devices can be used in parallel to increase the overall surge current rating. However, it's essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize inductance and resistance.

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SZP6SMB180AT3G Overview

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