EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY, LOW ZENER IMPEDANCE
Breakdown Voltage-Max:
31.5 V
Breakdown Voltage-Min:
28.5 V
Breakdown Voltage-Nom:
30 V
Clamping Voltage-Max:
41.4 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
R-PDSO-C2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Peak Rev Power Dis-Max:
600 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-65 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity:
BIDIRECTIONAL
Power Dissipation-Max:
0.55 W
Reference Standard:
AEC-Q101
Rep Pk Reverse Voltage-Max:
25.6 V
Surface Mount:
YES
Technology:
ZENER
Terminal Finish:
TIN
Terminal Form:
C BEND
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
SZP6SMB30CAT3G Frequently Asked Questions (FAQs)
The recommended PCB footprint for the SZP6SMB30CAT3G is a standard SOD-123 package with a minimum pad size of 0.8 mm x 0.8 mm and a maximum pad size of 1.2 mm x 1.2 mm, with a 0.5 mm spacing between pads.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or flux, and ensure the component is properly aligned on the PCB.
The maximum allowable voltage stress on the SZP6SMB30CAT3G is 30 V, as specified in the datasheet. Exceeding this voltage may cause permanent damage to the device.
The SZP6SMB30CAT3G is rated for operation up to 150°C, but it's recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet to ensure reliable operation.
Handle the SZP6SMB30CAT3G with ESD-protective equipment, such as wrist straps, mats, or bags, to prevent electrostatic discharge damage. Ensure the workspace is ESD-safe and follow proper handling procedures.
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SZP6SMB30CAT3G Overview
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