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T1014NXN7KQA - NXP

Description: Microprocessors - MPU QorIQ, 1xCPU 64-Bit Pwr Arch, 1.0GHz, DDR3L/4, PCIe, 1/10GbE, HW Accel, -40 to 105C, 23x23 pkg

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Symbol
T1014NXN7KQA - NXP - PCB symbol
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PCB Footprints
T1014NXN7KQA - NXP PCB footprint - BGA - BGA - SOT1652-3
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3D Models
T1014NXN7KQA - NXP - 3D model - BGA - SOT1652-3
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T1014NXN7KQA Details

  • Manufacturer Part Number:

    T1014NXN7KQA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

T1014NXN7KQA Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide in their application note AN12273, which includes thermal design considerations and layout recommendations for optimal heat dissipation.
  • NXP recommends following the guidelines outlined in their application note AN11538, which provides EMC design considerations and best practices for reducing electromagnetic interference (EMI) and ensuring compliance with regulatory standards.
  • NXP recommends using X7R or X5R ceramic capacitors with a minimum capacitance value of 4.7uF for Cin and Cout. The ESR should be less than 100mΩ for optimal performance. Refer to the application note AN12273 for more detailed guidance.
  • NXP provides a troubleshooting guide in their application note AN12274, which covers common issues, debugging techniques, and fault analysis methods for the T1014NXN7KQA.
  • The thermal resistance values for the T1014NXN7KQA are RθJA = 45°C/W and RθJC = 10°C/W, as specified in the datasheet. These values are critical for thermal design and heat dissipation calculations.

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T1014NXN7KQA Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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