T1022NXN7WQB footprint, schematic symbol and 3D model by NXP

Symbol

click to zoom

PCB Footprints

T1022NXN7WQB - NXP PCB footprint - BGA - BGA - SOT1652-1

click to zoom

Datasheet Download Datasheet
Stock & Prices Price & Stock for T1022NXN7WQB
Part Number T1022NXN7WQB
Manufacturer NXP
Pin Count 780
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - SOT1652-1
Released Date Aug 27, 2026
Last Modified Date Aug 27, 2026 12:43 PM UTC
Pinout / Pin List Click Here (Member Only)

T1022NXN7WQB Details

Manufacturer Part Number:
T1022NXN7WQB
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
FCBGA-780
ECCN Code:
3A991.A.1
HTS Code:
8542.31.00.01
Manufacturer:
NXP Semiconductors
YTEOL:
9
JESD-30 Code:
S-PBGA-B780
Length:
23 mm
Moisture Sensitivity Level:
3
Number of Terminals:
780
Operating Temperature-Max:
105 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
HFBGA
Package Equivalence Code:
BGA780,28X28,32
Package Shape:
SQUARE
Package Style:
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Cel):
250
Seated Height-Max:
2.07 mm
Supply Voltage-Max:
1.03 V
Supply Voltage-Min:
0.97 V
Supply Voltage-Nom:
1 V
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
23 mm
uPs/uCs/Peripheral ICs Type:
SoC

T1022NXN7WQB Frequently Asked Questions (FAQs)

NXP provides a reference design and layout guidelines in the T1022NXN7WQB datasheet and application notes. Additionally, it's recommended to follow the JEDEC JESD51-7 standard for thermal management and to use thermal vias and heat sinks to dissipate heat effectively.
The T1022NXN7WQB's clocking and PLL settings can be configured using the Clocking and PLL registers. NXP provides a detailed description of these registers in the device's reference manual. Additionally, NXP's Clocking and PLL configuration tool can be used to generate the required configuration code.
The T1022NXN7WQB requires a specific power sequencing and voltage requirements, which are detailed in the device's datasheet. The recommended power-up sequence is VDD_CORE, VDD_SOC, VDD_PLL, and VDD_DDR. The voltage requirements are 1.2V for VDD_CORE, 1.8V for VDD_SOC, and 1.8V for VDD_PLL.
The T1022NXN7WQB supports secure boot and encryption through its Security Engine (SE) and Cryptographic Acceleration Unit (CAU). NXP provides a detailed description of the secure boot process and encryption algorithms in the device's reference manual and security documentation. Additionally, NXP's Secure Boot and Encryption tools can be used to generate the required configuration code.
The T1022NXN7WQB's DDR memory interface has limitations and considerations that must be taken into account, such as DDR speed and timing, memory organization, and signal integrity. NXP provides a detailed description of these limitations and considerations in the device's datasheet and application notes.

Trust Checks

Community Provided

System Verified

Community Approved

T1022NXN7WQB Overview

Use the download button to access the T1022NXN7WQB schematic symbol and PCB footprint.

To find more CAD model downloads similar to this part, try a partial part number search, like T1022, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to T1022NXN7WQB

Showing 0 results