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T1235T-8FP - STMicroelectronics

Description: 12 A Snubberless™ Triac

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T1235T-8FP - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FPAB _-2021-s
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T1235T-8FP - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220FPAB _-2021-s
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T1235T-8FP Details

  • Manufacturer Part Number:

    T1235T-8FP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-220FPAB, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Commutation Voltage-Min:

    20 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    2000 V/us

  • DC Gate Trigger Current-Max:

    35 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    40 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Leakage Current-Max:

    0.0075 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-State Voltage-Max:

    1.55 V

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RMS On-state Current-Max:

    12 A

  • Reference Standard:

    UL CERTIFIED

  • Repetitive Peak Off-state Leakage Current-Max:

    2700 µA

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Trigger Device Type:

    SNUBBERLESS TRIAC

T1235T-8FP Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • STMicroelectronics recommends soldering the T1235T-8FP using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds.
  • To prevent ESD damage, handle the T1235T-8FP with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the device is stored in an ESD-protective package when not in use.
  • Store the T1235T-8FP in a dry, cool place with a temperature range of -40°C to 125°C (-40°F to 257°F) and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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T1235T-8FP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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