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T1250H-6T - STMicroelectronics

Description: TRIAC Alternistor - Snubberless 600 V 12 A Through Hole TO-220

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T1250H-6T - STMicroelectronics - PCB symbol
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PCB Footprints
T1250H-6T - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB(H=4.6mm)
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3D Models
T1250H-6T - STMicroelectronics - 3D model - Transistor Outline, Vertical - TO-220AB(H=4.6mm)
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T1250H-6T Details

  • Manufacturer Part Number:

    T1250H-6T

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Case Connection:

    MAIN TERMINAL 2

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    1500 V/us

  • DC Gate Trigger Current-Max:

    50 mA

  • DC Gate Trigger Voltage-Max:

    1 V

  • Holding Current-Max:

    75 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    12 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Trigger Device Type:

    SNUBBERLESS TRIAC

T1250H-6T Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure proper heat sinking, and consider using a thermal interface material (TIM) to reduce thermal resistance.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. It's crucial to ensure that the device operates within the recommended temperature range.
  • Yes, the T1250H-6T is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended qualification process, and ensure that the device meets the specific requirements of the application, including AEC-Q101 qualification.
  • To handle the high current capability of the T1250H-6T, it's essential to design the PCB with wide traces, multiple layers, and a robust power distribution network. Additionally, consider using a current sense resistor and a suitable fuse or overcurrent protection device.

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T1250H-6T Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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