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T1610-800G-TR - STMicroelectronics

Description: STMICROELECTRONICS - T1610-800G-TR - TRIAC, 16A, 800V, TO-263-3

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T1610-800G-TR - STMicroelectronics PCB footprint - Other - Other - D²PAK_2025-10
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T1610-800G-TR - STMicroelectronics  - 3D model - Other - D²PAK_2025-10
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T1610-800G-TR Details

  • Manufacturer Part Number:

    T1610-800G-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK

  • Package Description:

    D2PAK-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    40 V/us

  • DC Gate Trigger Current-Max:

    10 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    15 mA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    16 A

  • Repetitive Peak Off-state Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    4 QUADRANT LOGIC LEVEL TRIAC

T1610-800G-TR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
  • Ensure proper thermal management, follow the recommended PCB layout, and consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Pay attention to the input signal rise and fall times, clock frequency, and setup/hold times to ensure proper data transmission and reception.
  • Use oscilloscopes or logic analyzers to monitor signal quality, check for impedance mismatches, and verify proper termination and signal routing.
  • Use a combination of ceramic and electrolytic capacitors for power supply decoupling, and consider adding ferrite beads or inductors for filtering high-frequency noise.

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T1610-800G-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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