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T1650H-6G - STMicroelectronics

Description: 16 A - 600 V H-series Snubberless Triac

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T1650H-6G - STMicroelectronics PCB footprint - Other - Other - T1650H-6G-3
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T1650H-6G Details

  • Manufacturer Part Number:

    T1650H-6G

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK

  • Package Description:

    ROHS COMPLIANT, PLASTIC, D2PAK-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Case Connection:

    MAIN TERMINAL 2

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Commutation Voltage-Min:

    21 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    1000 V/us

  • DC Gate Trigger Current-Max:

    50 mA

  • DC Gate Trigger Voltage-Max:

    1 V

  • Holding Current-Max:

    75 mA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    16 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SNUBBERLESS TRIAC

T1650H-6G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid blocking airflow around the device.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering or hand soldering, as it may damage the device.
  • Handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure all equipment and personnel are grounded. Use an ESD wrist strap or mat when handling the device.
  • Store the device in a dry, cool place (20°C to 30°C or 68°F to 86°F) with relative humidity below 60%. Avoid exposure to direct sunlight, moisture, or contaminants.

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T1650H-6G Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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