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T2035T-8G-TR - STMicroelectronics

Description: Triacs 20 A 800 V D PAK Snubberless Triac

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T2035T-8G-TR - STMicroelectronics - PCB symbol
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PCB Footprints
T2035T-8G-TR - STMicroelectronics PCB footprint - Other - Other - D²PAK_2025-26
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T2035T-8G-TR - STMicroelectronics - 3D model - Other - D²PAK_2025-26
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T2035T-8G-TR Details

  • Manufacturer Part Number:

    T2035T-8G-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2018-10-11

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Case Connection:

    MAIN TERMINAL 2

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    1000 V/us

  • DC Gate Trigger Current-Max:

    35 mA

  • DC Gate Trigger Voltage-Max:

    1 V

  • Holding Current-Max:

    45 mA

  • JESD-30 Code:

    R-PSSO-G2

  • Leakage Current-Max:

    0.005 mA

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • On-State Voltage-Max:

    1.5 V

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • RMS On-state Current-Max:

    20 A

  • Repetitive Peak Off-state Leakage Current-Max:

    4100 µA

  • Repetitive Peak Off-state Voltage:

    800 V

  • Repetitive Peak Reverse Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Trigger Device Type:

    SNUBBERLESS TRIAC

T2035T-8G-TR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
  • STMicroelectronics recommends using ESD protection devices, such as TVS diodes, on the input and output pins to protect the device from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
  • Yes, the T2035T-8G-TR is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended design guidelines, testing, and validation procedures to ensure the device meets the specific application requirements.
  • STMicroelectronics recommends following the JEDEC J-STD-020 standard for soldering and rework conditions. The device can withstand a maximum of 3 reflow cycles, and the peak temperature should not exceed 260°C.

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T2035T-8G-TR Overview

Use the download button to access the T2035T-8G-TR schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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