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T20F400I4 - Efinix

Description: IC FPGA TRION T20 230 IO 400FBGA

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T20F400I4 - Efinix PCB footprint - BGA - BGA - 400 FBGA
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T20F400I4 - Efinix  - 3D model - BGA - 400 FBGA
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T20F400I4 Details

  • Manufacturer Part Number:

    T20F400I4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    FBGA-400

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    EFINIX

  • JESD-30 Code:

    S-PBGA-B400

  • Length:

    16 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    230

  • Number of Logic Cells:

    19728

  • Number of Outputs:

    230

  • Number of Terminals:

    400

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    SMIC

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    16 mm

T20F400I4 Frequently Asked Questions (FAQs)

  • EFINIX provides a reference design guide that includes recommended PCB layout and stackup guidelines for optimal signal integrity. It's recommended to follow these guidelines to ensure reliable operation and minimize signal degradation.
  • EFINIX recommends using an external POR circuit with a voltage supervisor IC, such as the TLV7031, to ensure a reliable and efficient power-on reset. The datasheet provides more information on POR circuit implementation.
  • EFINIX recommends using a heat sink or thermal pad on the top of the FPGA package, and ensuring good airflow around the device. The datasheet provides thermal resistance and power consumption data to help with thermal management.
  • EFINIX recommends using the FPGA's built-in power management features, such as clock gating and dynamic voltage and frequency scaling, to optimize power consumption. Additionally, using a low-power mode and reducing the operating frequency can also help minimize power consumption.
  • The internal oscillator is suitable for most applications, but it may not be suitable for high-frequency or high-precision applications. EFINIX recommends using an external oscillator for these types of applications, and provides guidelines for oscillator selection and implementation in the datasheet.

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