T2535T-8G-TR - STMicroelectronics

T2535T-8G-TR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  STMicroelectronics provides a recommended PCB layout in the application note AN5076, which includes guidelines for thermal pad connection, copper pour, and via placement to ensure optimal thermal performance.
• How do I handle the thermal shutdown feature?
  The thermal shutdown feature is enabled by default. To handle it, monitor the TSD (Thermal Shutdown) pin, which goes low when the junction temperature exceeds 150°C. When TSD is low, the device is in thermal shutdown mode, and the output voltage is disabled. Wait for the device to cool down before re-enabling the output voltage.
• What is the maximum allowed voltage on the enable pin (EN)?
  The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device. Ensure that the voltage on the EN pin does not exceed the recommended maximum voltage.
• Can I use the T2535T-8G-TR in a high-reliability or automotive application?
  Yes, the T2535T-8G-TR is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, ensure that you follow the recommended operating conditions, and consult with STMicroelectronics for specific requirements and guidelines.
• How do I calculate the power dissipation and junction temperature?
  Use the equations provided in the datasheet to calculate the power dissipation (PD) and junction temperature (TJ). PD = (VIN - VOUT) x IOUT, and TJ = TA + (PD x RθJA), where TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance.