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T2550-12G-TR - STMicroelectronics

Description: TRIAC Alternistor - Snubberless 1.2 kV 25 A Surface Mount D2PAK

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T2550-12G-TR - STMicroelectronics PCB footprint - Other - Other - D²PAK_2025-114
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T2550-12G-TR Details

  • Manufacturer Part Number:

    T2550-12G-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Case Connection:

    MAIN TERMINAL 2

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Commutation Voltage-Min:

    20 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    2500 V/us

  • DC Gate Trigger Current-Max:

    50 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    60 mA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • RMS On-state Current-Max:

    25 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Leakage Current-Max:

    10 µA

  • Repetitive Peak Off-state Voltage:

    1200 V

  • Repetitive Peak Reverse Voltage:

    1200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Trigger Device Type:

    SNUBBERLESS TRIAC

T2550-12G-TR Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout and thermal management strategy in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and signal integrity.
  • To minimize power consumption and heat generation, optimize the device's operating frequency, voltage, and current consumption. Implement power-saving modes, reduce clock speeds, and use low-power modes when possible. Additionally, ensure proper thermal design and heat sinking to dissipate heat efficiently.
  • Follow STMicroelectronics' recommended ESD protection and handling procedures to prevent damage during handling, storage, and assembly. Use ESD-safe materials, grounding straps, and follow proper handling techniques to minimize the risk of electrostatic discharge damage.
  • To ensure signal integrity and minimize EMI, follow best practices for PCB design, such as using differential signaling, shielding, and proper grounding. Implement EMI filters, and ensure that the device is properly decoupled and bypassed. Additionally, use simulation tools to analyze and optimize signal integrity and EMI performance.
  • STMicroelectronics provides reliability and lifespan data in their datasheets and application notes. The device's reliability and lifespan are influenced by factors such as operating temperature, voltage, and current. Ensure that your design operates within the recommended specifications to maximize reliability and lifespan.

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T2550-12G-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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