T835T-8G - STMicroelectronics

T835T-8G Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  STMicroelectronics provides a recommended PCB layout in their application note AN5046, which includes guidelines for thermal pad connection, copper pour, and via placement to ensure optimal thermal performance.
• How do I handle the thermal shutdown feature during power-up?
  The thermal shutdown feature is enabled by default. To handle it during power-up, ensure that the device is powered up slowly (dv/dt < 10 V/μs) to prevent false thermal shutdown triggers. Additionally, consider adding a soft-start circuit to control the power-up sequence.
• What is the maximum allowed voltage on the enable pin (EN)?
  Although the datasheet doesn't specify a maximum voltage for the enable pin, it's recommended to keep it within the VCC voltage range (typically 5 V or 3.3 V) to ensure proper operation and prevent damage to the device.
• Can I use the T835T-8G in a high-reliability or automotive application?
  Yes, the T835T-8G is AEC-Q100 qualified, making it suitable for automotive applications. Additionally, STMicroelectronics provides a dedicated high-reliability version, the T835T-8G-HR, which is designed for high-reliability applications.
• How do I calculate the power dissipation and junction temperature?
  Use the equations provided in the datasheet to calculate the power dissipation (PD) and junction temperature (TJ). For example, PD = (VIN - VOUT) * IOUT, and TJ = TA + (PD * RθJA), where TA is the ambient temperature and RθJA is the junction-to-ambient thermal resistance.