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TA75W01FU,LF - Toshiba

Description: Standard Amplifier 2 Circuit 8-SSOP

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TA75W01FU,LF - Toshiba  - 3D model
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TA75W01FU,LF Details

  • Manufacturer Part Number:

    TA75W01FU,LF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP8,.16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.3 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    300

  • Voltage Gain-Min:

    19952.62314

  • Wideband:

    NO

  • Width:

    2.8 mm

TA75W01FU,LF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended for optimal thermal performance. The thermal pad should be connected to the ground plane to dissipate heat efficiently.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator and a decoupling capacitor are recommended to ensure a stable input voltage.
  • The maximum allowed power dissipation for the TA75W01FU,LF is 1.5W. Exceeding this limit may cause the device to overheat and reduce its lifespan.
  • The TA75W01FU,LF is rated for operation up to 125°C. However, the device's performance and lifespan may be affected at high temperatures. It is recommended to use a heat sink or a thermal management system to maintain a safe operating temperature.
  • The TA75W01FU,LF is sensitive to electrostatic discharge. It is recommended to handle the device with an anti-static wrist strap or mat, and to use ESD-protected packaging and storage.

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TA75W01FU,LF Overview

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