ADDRESS BUS WIDTH IS 11 AND DATA BUS WIDTH IS 8 IN EXTERNAL MCU MODE
Bit Size:
8
Bus Compatibility:
USB
Clock Frequency-Max:
6 MHz
DAC Channels:
NO
DMA Channels:
YES
Data Transfer Rate-Max:
1.5 MBps
JESD-30 Code:
S-PQFP-G48
JESD-609 Code:
e4
Length:
7 mm
Moisture Sensitivity Level:
2
Number of I/O Lines:
14
Number of Terminals:
48
Operating Temperature-Max:
70 °C
PWM Channels:
NO
Package Body Material:
PLASTIC/EPOXY
Package Code:
TFQFP
Package Shape:
SQUARE
Package Style:
FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
ROM Programmability:
MROM
Screening Level:
TS 16949
Seated Height-Max:
1.2 mm
Speed:
6 MHz
Supply Voltage-Max:
3.6 V
Supply Voltage-Min:
3 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
7 mm
uPs/uCs/Peripheral ICs Type:
BUS CONTROLLER, UNIVERSAL SERIAL BUS
TAS1020BPFBRG4 Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the power supply decoupling capacitors are placed close to the device.
To minimize power consumption, ensure that the device is operated in the correct mode (e.g., idle or shutdown) when not in use. Adjust the clock frequency and voltage regulator settings according to your application's requirements. Additionally, consider using the device's built-in power-saving features, such as the low-power mode.
The TAS1020BPFBRG4 has a thermal pad on the bottom of the package, which requires a thermal connection to a heat sink or a thermal pad on the PCB. Ensure that the thermal connection is made using a suitable thermal interface material, and that the heat sink is designed to dissipate the maximum expected power dissipation.
To troubleshoot audio performance issues, start by verifying that the device is properly configured and that the audio signals are correctly routed. Check the device's clock frequency, voltage regulator settings, and audio codec configuration. Use oscilloscopes or audio analyzers to measure the audio signals and identify any distortions or anomalies.
To minimize EMI and RFI, ensure that the device is properly shielded, and that the PCB layout is designed to reduce electromagnetic radiation. Use shielding cans or enclosures, and consider adding EMI filters or ferrite beads to the power supply lines. Additionally, follow good PCB design practices, such as using a solid ground plane and minimizing trace lengths.
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TAS1020BPFBRG4 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
