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TAS5825MRHBR - Texas Instruments

Description: 4.5V to 26V, 38-W Stereo, Digital Input, Class-D Audio Amp with 96-kHz/192-kHz flexible Processing

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TAS5825MRHBR - Texas Instruments - PCB symbol
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PCB Footprints
TAS5825MRHBR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHB0032E-
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TAS5825MRHBR - Texas Instruments - 3D model - Quad Flat No-Lead - RHB0032E-
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TAS5825MRHBR Details

  • Manufacturer Part Number:

    TAS5825MRHBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2018-01-05

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Channel Separation:

    100 dB

  • Consumer IC Type:

    VOLUME CONTROL CIRCUIT

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    111 dB

  • Number of Bands:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Power-Nom:

    38 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    26.4 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

TAS5825MRHBR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TAS5825MRHBR involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. TI provides a recommended layout in the datasheet and application notes.
  • To optimize thermal performance, ensure good airflow around the device, use a heat sink if possible, and avoid blocking the thermal pads on the package. TI also provides thermal design guidelines in the datasheet.
  • The recommended power-up sequence is to apply the analog power supply (AVDD) first, followed by the digital power supply (DVDD), and then the clock signal. This ensures proper device initialization and prevents latch-up.
  • TI provides a troubleshooting guide in the datasheet and application notes. Common issues include incorrect power-up sequencing, inadequate power supply decoupling, and incorrect clock signal configuration.
  • Key considerations for EMI and EMC include using a shielded enclosure, minimizing loop areas in the PCB layout, and using EMI filters on the power supply and clock signals. TI also provides EMI and EMC guidelines in the datasheet and application notes.

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TAS5825MRHBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TAS5825MRHBT Texas Instruments

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