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TB62706BFG - Toshiba

Description: Toshiba TB62706BFG, LED Driver, 5 V, 24-Pin SSOP

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TB62706BFG - Toshiba - PCB symbol
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PCB Footprints
TB62706BFG - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - 24-Pin SSOP
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TB62706BFG Details

  • Manufacturer Part Number:

    TB62706BFG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    1.00 MM PITCH, PLASTIC, SSOP-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    13 mm

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    16

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-COLLECTOR

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.9 mm

  • Supply Current-Max:

    38.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Width:

    6 mm

  • fmax-Min:

    10 MHz

TB62706BFG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power dissipation according to the datasheet's thermal derating curve.
  • Handle the device in an ESD-controlled environment, use wrist straps or mats, and follow standard ESD handling procedures. The device has built-in ESD protection, but it's not a substitute for proper handling precautions.
  • Yes, the TB62706BFG is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines to ensure reliability.
  • Consult the datasheet's troubleshooting section, check for proper power supply decoupling, and verify that the device is operated within the recommended conditions. If issues persist, contact Toshiba's technical support for further assistance.

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TB62706BFG Overview

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