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TBD62003AFNG,EL - Toshiba

Description: Gate Drivers DMOS Transistor Array 7-CH, 50V/0.5A

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PCB Footprints
TBD62003AFNG,EL - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - SSOP16-P-225_0.65B
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3D Models
TBD62003AFNG,EL - Toshiba  - 3D model - Small Outline Packages - SSOP16-P-225_0.65B
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TBD62003AFNG,EL Details

  • Manufacturer Part Number:

    TBD62003AFNG,EL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7.15

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    5.5 mm

  • Number of Functions:

    7

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.4 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max:

    25 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    DMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.8 µs

  • Turn-on Time:

    0.4 µs

  • Width:

    4.4 mm

TBD62003AFNG,EL Frequently Asked Questions (FAQs)

  • The recommended PCB layout for TBD62003AFNG involves placing the device near the power source, using a solid ground plane, and minimizing the length of the power traces to reduce EMI.
  • To ensure the TBD62003AFNG operates within its SOA, monitor the device's junction temperature, output current, and input voltage to prevent overheating, overcurrent, and overvoltage conditions.
  • For TBD62003AFNG, thermal management involves providing adequate heat dissipation through a heat sink, thermal interface material, and airflow to prevent overheating and ensure reliable operation.
  • Yes, TBD62003AFNG is suitable for high-reliability applications due to its robust design, high-quality manufacturing, and rigorous testing, making it a reliable choice for demanding applications.
  • To troubleshoot TBD62003AFNG-related issues, start by verifying the device's pin connections, checking for proper power supply and grounding, and using oscilloscopes or logic analyzers to debug the circuit.

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TBD62003AFNG,EL Overview

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