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TBD62003AFWG - Toshiba

Description: TRANS ARRAY INTERFACE DRV

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PCB Footprints
TBD62003AFWG - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - P-SOP16-0410-1.27-002
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TBD62003AFWG - Toshiba  - 3D model - Small Outline Packages - P-SOP16-0410-1.27-002
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TBD62003AFWG Details

  • Manufacturer Part Number:

    TBD62003AFWG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10 mm

  • Number of Functions:

    7

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.4 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.73 mm

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max:

    25 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    DMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.8 µs

  • Turn-on Time:

    0.4 µs

  • Width:

    3.94 mm

TBD62003AFWG Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended operating conditions and derating guidelines.
  • The maximum allowed voltage on the input pins is 5.5V, exceeding which may cause damage to the device.
  • Yes, the TBD62003AFWG is designed to operate in a humid environment, but it's recommended to follow proper moisture sensitivity level (MSL) handling and storage procedures to prevent damage.
  • Check the input voltage, ensure proper power sequencing, verify the enable pin is properly biased, and check for any short circuits or damage to the device or PCB.

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TBD62003AFWG Overview

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