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TBD62064APG - Toshiba

Description: Gate Drivers DMOS Transistor Array 4-CH 50V/1.5A

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PCB Footprints
TBD62064APG - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP16-P-300-2.54A-2022
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3D Models
TBD62064APG - Toshiba  - 3D model - Dual-In-Line Packages - DIP16-P-300-2.54A-2022
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TBD62064APG Details

  • Manufacturer Part Number:

    TBD62064APG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    5.62

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDIP-T16

  • Length:

    19.25 mm

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    1.25 A

  • Output Peak Current Limit-Nom:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    4.45 mm

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max:

    25 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    DMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.62 mm

TBD62064APG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients and thermal stress.
  • The TBD62064APG has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures to prevent damage during handling and assembly.
  • Yes, the TBD62064APG is qualified for automotive and high-reliability applications, but additional testing and validation may be required to meet specific industry standards.
  • Use a logic analyzer or oscilloscope to monitor the device's inputs and outputs, and consult the datasheet and application notes for troubleshooting guidelines.

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TBD62064APG Overview

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