Part Image

TBD62083AFNG(Z) - Toshiba

Description: TBD62083AFNG(Z),DMOS Transistor Array

Download TBD62083AFNG(Z) Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TBD62083AFNG(Z) - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - SOP18-P
click to zoom
3D Models
TBD62083AFNG(Z) - Toshiba  - 3D model - Small Outline Packages - SOP18-P
click to zoom

TBD62083AFNG(Z) Details

  • Manufacturer Part Number:

    TBD62083AFNG(Z)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-18

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7.3

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    8

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G18

  • Length:

    6.8 mm

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.4 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP18,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    25 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.8 µs

  • Turn-on Time:

    0.4 µs

  • Width:

    4.4 mm

TBD62083AFNG(Z) Frequently Asked Questions (FAQs)

  • Toshiba provides a recommended PCB layout in their application note, which includes guidelines for component placement, thermal management, and signal routing to minimize noise and ensure reliable operation.
  • The TBD62083AFNG(Z) has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, a heat sink or thermal interface material can be used to further improve thermal management.
  • The TBD62083AFNG(Z) has an operating temperature range of -40°C to 125°C, but it's recommended to derate the device's performance at higher temperatures to ensure reliability.
  • To ensure EMC, follow proper PCB design and layout guidelines, use shielding and filtering components as needed, and ensure that the device is properly decoupled from the power supply and other noise sources.
  • The TBD62083AFNG(Z) has a specific power-up sequence recommended by Toshiba to ensure proper initialization and operation. This sequence should be followed to prevent damage or malfunction.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TBD62083AFNG(Z) Overview

Use the download button to access the TBD62083AFNG(Z) schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TBD62, or try a keyword search, such as Peripheral Drivers

Parts related to TBD62083AFNG(Z)

Showing 0 results