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TBD62083AFWG(Z,EHZ - Toshiba

Description: DMOS Transistor Array to 18-Pin SOP

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TBD62083AFWG(Z,EHZ - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - P-SOP18-0812-1.27-001
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TBD62083AFWG(Z,EHZ - Toshiba  - 3D model - Small Outline Packages - P-SOP18-0812-1.27-001
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TBD62083AFWG(Z,EHZ Details

  • Manufacturer Part Number:

    TBD62083AFWG(Z,EHZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-18

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    8

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G18

  • Length:

    11.515 mm

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.37 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP18,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    2.85 mm

  • Supply Voltage-Max:

    25 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.495 mm

TBD62083AFWG(Z,EHZ Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a solid ground plane and thermal vias under the package to improve heat dissipation. A minimum of 2oz copper thickness is recommended for the PCB.
  • To ensure reliable operation at high temperatures, it is recommended to follow the thermal design guidelines, use a heat sink if necessary, and ensure that the device is operated within the specified temperature range.
  • The maximum allowable voltage on the input pins is the voltage rating of the device (VCC) plus 0.3V. Exceeding this voltage may cause damage to the device.
  • Toshiba recommends using ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge.
  • The recommended power-up sequence is to apply VCC first, followed by the input signals. This ensures that the device is properly initialized and configured.

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TBD62083AFWG(Z,EHZ Overview

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