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TBD62502APG - Toshiba

Description: 7 circuits built-in • High voltage : VOUT = 50 V (MAX) • High current : IOUT = 300 mA/ch (MAX) • Input voltage(output on) : TBD62502A series 14 V (MIN) TBD62503A series 2.5 V (MIN) • Input voltage(output off) : TBD62502A series 7.0 V (MAX) TBD62503A series 0.6 V (MAX) • Package : PG type DIP16-P-300-2.54A FG type SOP16-P-225-1.27 FNG type SSOP16-P-225-0.65B FWG type P-SOP16-0410-1.27-002

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TBD62502APG - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP-16-P-300-2.54A
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TBD62502APG - Toshiba  - 3D model - Dual-In-Line Packages - DIP-16-P-300-2.54A
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TBD62502APG Details

  • Manufacturer Part Number:

    TBD62502APG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    5.62

  • Driver Number of Bits:

    7

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDIP-T16

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Technology:

    DMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

TBD62502APG Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to consider derating the device's power dissipation according to the ambient temperature.
  • Although the datasheet doesn't specify a maximum allowable voltage, it's generally recommended to limit the input voltage to 5.5V to prevent damage to the internal ESD protection diodes.
  • While the TBD62502APG is primarily designed for audio applications, it can be used in high-frequency switching applications up to 100 kHz. However, the device's performance and reliability may be affected, and additional design considerations are necessary.
  • To troubleshoot issues, start by verifying the power supply voltage, checking for proper PCB layout and thermal design, and ensuring that the input signals are within the recommended specifications. If issues persist, consult Toshiba's application notes and technical support resources.

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TBD62502APG Overview

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