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TBD62783AFG - Toshiba

Description: TOSHIBA BiCD Integrated Circuit Silicon Monolithic

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TBD62783AFG - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - SOP18-P-375-1.27
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TBD62783AFG - Toshiba  - 3D model - Small Outline Packages - SOP18-P-375-1.27
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TBD62783AFG Details

  • Manufacturer Part Number:

    TBD62783AFG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-18

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7.05

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G18

  • Length:

    12.5 mm

  • Number of Functions:

    8

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Current-Max:

    0.4 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP18,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    2.45 mm

  • Supply Current-Max:

    12 mA

  • Supply Voltage-Max:

    50 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    DMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7 mm

TBD62783AFG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended to be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the input capacitor (Cin) is placed close to the VIN pin, and the output capacitor (Cout) is placed close to the VOUT pin. Also, use a low-ESR capacitor for Cout.
  • The TBD62783AFG is rated for operation up to 85°C ambient temperature. However, derating is recommended above 70°C to ensure reliable operation.
  • No, a ceramic capacitor is not recommended for Cin due to its high impedance at high frequencies. A low-ESR electrolytic capacitor or a film capacitor is recommended instead.
  • The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of Cout, and fsw is the switching frequency.

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TBD62783AFG Overview

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