TBD62783AFWG(Z,EHZ footprint, schematic symbol and 3D model by Toshiba

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Part Number TBD62783AFWG(Z,EHZ
Manufacturer Toshiba
Pin Count 18
Part Category Transistor
Package Category Small Outline Packages
Footprint Name Small Outline Packages - TBD62783AFWG(Z,EHZ
Released Date Jun 12, 2019
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

TBD62783AFWG(Z,EHZ Details

Manufacturer Part Number:
TBD62783AFWG(Z,EHZ
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
SOP-18
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Manufacturer:
Toshiba America Electronic Components
YTEOL:
7.05
Built-in Protections:
TRANSIENT
Driver Number of Bits:
1
Input Characteristics:
STANDARD
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PDSO-G18
Length:
13 mm
Number of Functions:
8
Number of Terminals:
18
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Current Flow Direction:
SOURCE
Output Current-Max:
0.4 A
Output Peak Current Limit-Nom:
0.4 A
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP18,.4
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Seated Height-Max:
2.45 mm
Supply Current-Max:
12 mA
Supply Voltage-Max:
50 V
Supply Voltage-Min:
2 V
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Technology:
DMOS
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Width:
7 mm

TBD62783AFWG(Z,EHZ Frequently Asked Questions (FAQs)

A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design guidelines, such as using a heat sink, and to ensure that the device is operated within its specified temperature range.
The TBD62783AFWG(Z,EHZ has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing to prevent damage to the device.
The TBD62783AFWG(Z,EHZ is an AEC-Q100 qualified device, making it suitable for use in automotive applications. However, it is recommended to consult with Toshiba's automotive support team to ensure that the device meets the specific requirements of the application.
The recommended soldering profile for the TBD62783AFWG(Z,EHZ is a peak temperature of 260°C, with a dwell time of 30-60 seconds. It is recommended to follow the soldering guidelines outlined in the Toshiba application note.

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TBD62783AFWG(Z,EHZ Overview

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TBD62783AFWG(Z,EHZ - Toshiba

TBD62783AFWG(Z,EHZ Details

TBD62783AFWG(Z,EHZ Frequently Asked Questions (FAQs)

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