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TC1411NEOA713 - Microchip

Description: Low-Side Gate Driver IC Non-Inverting 8-SOIC

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TC1411NEOA713 - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
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3D Models
TC1411NEOA713 - Microchip  - 3D model - Small Outline Packages - 8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
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TC1411NEOA713 Details

  • Manufacturer Part Number:

    TC1411NEOA713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Peak Current Limit-Nom:

    1 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    16 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage1-Max:

    16 V

  • Supply Voltage1-Min:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.085 µs

  • Turn-on Time:

    0.085 µs

  • Width:

    3.9 mm

TC1411NEOA713 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TC1411NEOA713 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and keeping the switching node (SW) away from sensitive analog circuits can help minimize EMI.
  • The inductor value depends on the input voltage, output voltage, and switching frequency. A good starting point is to use the inductor value recommended in the datasheet (e.g., 10uH). Then, adjust the value based on the specific application requirements, such as output current and ripple voltage.
  • The TC1411NEOA713 is rated for operation from -40°C to +125°C. However, the maximum ambient temperature range may be limited by the specific application and the thermal design of the PCB.
  • To ensure stability, follow the recommended component values and PCB layout guidelines in the datasheet. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. If oscillations occur, try adding a small capacitor (e.g., 10nF) between the VCC and GND pins.
  • Yes, the TC1411NEOA713 can be used in a synchronous rectification configuration. However, this requires additional external components and careful design to ensure proper operation. Consult the datasheet and application notes for more information.

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TC1411NEOA713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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