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TC358768AXBG - Toshiba

Description: Display Interface Bridge 72-Pin VFBGA - Bulk

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Symbol
TC358768AXBG - Toshiba - PCB symbol
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PCB Footprints
TC358768AXBG - Toshiba PCB footprint - BGA - BGA - 12065Z106KAT2A
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3D Models
TC358768AXBG - Toshiba - 3D model - BGA - 12065Z106KAT2A
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TC358768AXBG Details

  • Manufacturer Part Number:

    TC358768AXBG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-81/72

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-XBGA-B72

  • Length:

    4.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    72

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA72,9x9,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.3 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    4.5 mm

TC358768AXBG Frequently Asked Questions (FAQs)

  • Toshiba provides a recommended PCB layout in the application note 'TC358768AXBG PCB Layout Guide' (document number: TC358768AXBG-AN001). It's essential to follow this guide to ensure optimal performance, minimize noise, and reduce EMI.
  • The TC358768AXBG has a thermal pad on the bottom of the package. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink. The recommended thermal resistance (θja) is 30°C/W. Refer to the 'Thermal Design Considerations' section in the datasheet for more information.
  • The TC358768AXBG supports up to 1.5 Gbps per lane for the MIPI CSI-2 interface, which translates to a maximum clock frequency of 375 MHz (1.5 Gbps / 4 lanes). However, the actual clock frequency may be limited by the system design and the camera module used.
  • The TC358768AXBG is designed specifically for MIPI CSI-2 camera modules. While it may be possible to use it with a non-MIPI camera module, it would require additional circuitry and may not be compatible. It's recommended to use a MIPI CSI-2 compliant camera module for optimal performance and compatibility.
  • The TC358768AXBG requires configuration for different camera modules through the I2C interface. Toshiba provides a software development kit (SDK) and a configuration tool to help with this process. Refer to the 'Configuration and Programming' section in the datasheet for more information.

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TC358768AXBG Overview

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