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TC358778XBG(EL) - Toshiba

Description: Interface - Specialized Display Interface Bridge

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TC358778XBG(EL) - Toshiba - PCB symbol
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PCB Footprints
TC358778XBG(EL) - Toshiba PCB footprint - BGA - BGA - P-VFBGA80-0707-0.65-001
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3D Models
TC358778XBG(EL) - Toshiba - 3D model - BGA - P-VFBGA80-0707-0.65-001
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TC358778XBG(EL) Details

  • Manufacturer Part Number:

    TC358778XBG(EL)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-80

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PBGA-B80

  • Length:

    7 mm

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA80,10X10,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    1.3 V

  • Supply Voltage-Min (Vsup):

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7 mm

TC358778XBG(EL) Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital signal traces separate and avoid crossing them over each other.
  • Use a reliable clock source, ensure proper signal termination, and implement error detection and correction mechanisms such as CRC and checksums.
  • The maximum cable length depends on the specific application and signal frequency. As a general guideline, the TC358778XBG(EL) supports up to 3 meters of cable length at 6 Gbps.
  • Yes, the TC358778XBG(EL) supports multi-lane configurations. However, it requires proper lane alignment, clock domain crossing, and signal integrity considerations.
  • Ensure good airflow around the device, use a heat sink if necessary, and implement thermal monitoring and shutdown mechanisms to prevent overheating.

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TC358778XBG(EL) Overview

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