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TC367DP64F300SAAKXUMA1 - Infineon

Description: 32-bit Microcontroller

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Symbol
TC367DP64F300SAAKXUMA1 - Infineon - PCB symbol
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PCB Footprints
TC367DP64F300SAAKXUMA1 - Infineon PCB footprint - BGA - BGA - LF-BGA-292-6
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3D Models
TC367DP64F300SAAKXUMA1 - Infineon - 3D model - BGA - LF-BGA-292-6
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TC367DP64F300SAAKXUMA1 Details

  • Manufacturer Part Number:

    TC367DP64F300SAAKXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFBGA-292

  • Country Of Origin:

    Germany, Mainland China, Singapore, South Korea, Taiwan

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Date Of Intro:

    2020-01-02

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Has ADC:

    YES

  • Additional Feature:

    IT ALSO OPERATES AT 5V NOM SUPPLY

  • Bit Size:

    32

  • Clock Frequency-Max:

    160 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B292

  • JESD-609 Code:

    e2

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    292

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    300 MHz

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

TC367DP64F300SAAKXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design and layout guidelines in their application notes and design guides. It's essential to follow these guidelines to ensure optimal thermal performance and minimize electromagnetic interference (EMI).
  • Monitor the device's temperature using the built-in thermal sensor or an external temperature sensor. Implement a thermal management strategy, such as heat sinks, thermal interfaces, and airflow management, to keep the junction temperature within the specified range.
  • Follow the power-up and power-down sequences outlined in the datasheet and application notes. Ensure that the power supplies are ramped up and down slowly to prevent voltage spikes and inrush currents.
  • Use Infineon's development tools, such as the TC367DP64F300SAAKXUMA1 evaluation board and software development kits, to debug and troubleshoot issues. Consult the datasheet, application notes, and online resources for troubleshooting guides and FAQs.
  • Operating the device outside the recommended conditions can lead to reduced performance, reliability issues, or even damage to the device. Ensure that the device operates within the specified ranges to guarantee optimal performance and reliability.

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TC367DP64F300SAAKXUMA1 Overview

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