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TC389QP160F300SAEKXUMA2 - Infineon

Description: TriCore™ AURIX™ Microcontroller IC 32-Bit 6-Core 300MHz 10MB (10M x 8) FLASH PG-FBGA-516-1

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TC389QP160F300SAEKXUMA2 - Infineon PCB footprint - BGA - BGA - PG-LFBGA-516-5
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TC389QP160F300SAEKXUMA2 - Infineon  - 3D model - BGA - PG-LFBGA-516-5
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TC389QP160F300SAEKXUMA2 Details

  • Manufacturer Part Number:

    TC389QP160F300SAEKXUMA2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-516

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    33 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8.2

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    TC1.6.2

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B516

  • Length:

    25 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    128

  • Number of Terminals:

    516

  • Number of Timers:

    2

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA516,30X30,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    573440

  • ROM (words):

    10485760

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100; ISO 26262

  • Seated Height-Max:

    1.7 mm

  • Speed:

    300 MHz

  • Supply Current-Max:

    1100 mA

  • Supply Voltage-Max:

    1.375 V

  • Supply Voltage-Min:

    1.125 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    25 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

TC389QP160F300SAEKXUMA2 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for the TC389QP160F300SAEKXUMA2, which includes recommendations for PCB layout, thermal management, and decoupling. It's essential to follow these guidelines to ensure optimal performance, reliability, and thermal dissipation.
  • To ensure EMC and reduce EMI, follow Infineon's guidelines for PCB layout, component placement, and shielding. Additionally, consider using EMI filters, shielding cans, and proper grounding techniques to minimize radiation and susceptibility.
  • Monitor the TC389QP160F300SAEKXUMA2's temperature, voltage, and current to detect potential faults. Implement a monitoring system that tracks these parameters and sets thresholds for alerts and notifications. This enables predictive maintenance and reduces downtime.
  • Optimize the power supply design by selecting the appropriate voltage regulator, capacitors, and inductors. Ensure the power supply can provide the required current and voltage while minimizing power losses and heat generation. Consult Infineon's application notes and reference designs for guidance.
  • Develop a comprehensive testing and validation plan that includes functional testing, performance testing, and environmental testing. Consult Infineon's testing guidelines and application notes for specific procedures and requirements.

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TC389QP160F300SAEKXUMA2 Overview

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