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TC551001BPL-70L - Toshiba

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TC551001BPL-70L - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - TC551001BPL-70L
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TC551001BPL-70L - Toshiba  - 3D model - Dual-In-Line Packages - TC551001BPL-70L
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TC551001BPL-70L Details

  • Manufacturer Part Number:

    TC551001BPL-70L

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    0.600 INCH, PLASTIC, DIP-32

  • Pin Count:

    32

  • Reach Compliance Code:

    Unknown

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Access Time-Max:

    70 ns

  • JESD-30 Code:

    R-PDIP-T32

  • Length:

    42 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    128KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

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TC551001BPL-70L Overview

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Part Image TC551001APL-70L Toshiba America Electronic Components

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Part Image AKM628128LP-7 Asahi Kasei Microsystems Corporation

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