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TC5516AP-2 - Toshiba

Description: 2048 WORD x 8 BIT CMOS STATIC RAM

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PCB Footprints
TC5516AP-2 - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP4_2021
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3D Models
TC5516AP-2 - Toshiba  - 3D model - Dual-In-Line Packages - DIP4_2021
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TC5516AP-2 Details

  • Manufacturer Part Number:

    TC5516AP-2

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DIP-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Access Time-Max:

    200 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDIP-T24

  • JESD-609 Code:

    e0

  • Memory Density:

    16384 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Number of Terminals:

    24

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Organization:

    2KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP24,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Standby Current-Max:

    0.00003 A

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

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TC5516AP-2 Overview

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