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TC58BYG2S0HBAI6 - Toshiba

Description: IC EEPROM 4GBIT 25NS 67VFBGA

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Symbol
TC58BYG2S0HBAI6 - Toshiba - PCB symbol
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PCB Footprints
TC58BYG2S0HBAI6 - Toshiba PCB footprint - BGA - BGA - P-VFBGA67-0608-0.80-001
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TC58BYG2S0HBAI6 - Toshiba - 3D model - BGA - P-VFBGA67-0608-0.80-001
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TC58BYG2S0HBAI6 Details

  • Manufacturer Part Number:

    TC58BYG2S0HBAI6

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    BGA

  • Package Description:

    VFBGA-67

  • Pin Count:

    67

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Toshiba America Electronic Components

  • Access Time-Max:

    25 ns

  • JESD-30 Code:

    R-PBGA-B67

  • Length:

    8 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    67

  • Number of Words:

    536870912 words

  • Number of Words Code:

    512000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA67,8X10,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    1 mm

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NAND TYPE

  • Width:

    6.5 mm

  • Write Cycle Time-Max (tWC):

    0.000025 ms

  • Write Protection:

    HARDWARE

TC58BYG2S0HBAI6 Frequently Asked Questions (FAQs)

  • Toshiba provides a recommended PCB layout in their application note (TAEC-AN-1201) for the TC58BYG2S0HBAI6. It includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The TC58BYG2S0HBAI6 has a thermal rating of 150°C. To manage thermal performance, ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout guidelines. Additionally, consider using thermal interface materials and thermal vias to dissipate heat effectively.
  • Although the datasheet doesn't specify a maximum operating frequency, Toshiba recommends operating the TC58BYG2S0HBAI6 at frequencies up to 133 MHz. However, it's essential to consult with Toshiba's technical support or application notes for specific frequency-related guidance.
  • The TC58BYG2S0HBAI6 is an industrial-grade device, but it's not specifically designed for high-reliability or automotive applications. For such applications, consider using devices with higher reliability ratings, such as AEC-Q100 or ISO 26262 compliant devices.
  • Toshiba recommends a power-up sequence of VCC first, followed by VPP, and then the clock signal. This sequence helps prevent latch-up and ensures proper device operation. Consult the datasheet and application notes for more detailed information.

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