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TC7106CKW713 - Microchip

Description: LCD Drivers w/LCD Driver

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TC7106CKW713 - Microchip - PCB symbol
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PCB Footprints
TC7106CKW713 - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - pg-44-Lead PQFP-1
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TC7106CKW713 - Microchip - 3D model - Quad Flat Packages - pg-44-Lead PQFP-1
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TC7106CKW713 Details

  • Manufacturer Part Number:

    TC7106CKW713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    44

  • Manufacturer Package Code:

    MQFP-44

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Analog Input Voltage-Max:

    3.35 V

  • Analog Input Voltage-Min:

    2.7 V

  • Converter Type:

    ADC, DUAL-SLOPE

  • JESD-30 Code:

    S-PQFP-G44

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP44,.52SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.45 mm

  • Supply Current-Max:

    1.8 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

TC7106CKW713 Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TC7106CKW713 involves keeping the analog and digital grounds separate, using a star-ground configuration, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a solid ground plane to minimize noise and EMI.
  • To ensure accurate temperature measurement, it's essential to follow proper thermal design practices, such as using a thermally conductive material for the PCB, keeping the device away from heat sources, and using a thermocouple or thermistor with a high accuracy rating. Additionally, calibrating the device and using a high-quality voltage reference can also improve accuracy.
  • The TC7106CKW713 has an operating temperature range of -40°C to +125°C, but the accuracy of the temperature measurement may degrade at extreme temperatures. It's recommended to consult the datasheet for specific temperature-related specifications and to consider using a temperature sensor with a wider operating range if necessary.
  • The TC7106CKW713 is designed to operate with a 3.3V power supply, but it can tolerate a maximum voltage of 5.5V. However, operating the device at 5V may reduce its accuracy and reliability. It's recommended to use a 3.3V power supply or a voltage regulator to ensure optimal performance.
  • The TC7106CKW713 has a 3-wire serial interface that can be easily interfaced with a microcontroller. The device requires a clock signal, a data input/output line, and a chip select line. The microcontroller can send commands and read data from the TC7106CKW713 using a standard SPI protocol.

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TC7106CKW713 Overview

Use the download button to access the TC7106CKW713 schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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