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TC72-3.3MUATR - Microchip

Description: Board Mount Temperature Sensors High-Accuracy 10-bit

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TC72-3.3MUATR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Micro Small Outline Package (MS)
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TC72-3.3MUATR - Microchip  - 3D model - Small Outline Packages - 8-Lead Plastic Micro Small Outline Package (MS)
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TC72-3.3MUATR Details

  • Manufacturer Part Number:

    TC72-3.3MUATR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Accuracy-Max (Cel):

    3 Cel

  • Additional Feature:

    SEATED HEIGHT-MAX

  • Body Breadth:

    3 mm

  • Body Height:

    1.1 mm

  • Body Length or Diameter:

    3 mm

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    10

  • Number of Terminals:

    8

  • Operating Current-Max:

    0.4 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Interface Type:

    4-WIRE INTERFACE

  • Output Voltage-Max:

    2.178 V

  • Output Voltage-Min:

    0.66 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape/Style:

    SQUARE

  • Screening Level:

    TS 16949

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.65 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Termination Type:

    SOLDER

TC72-3.3MUATR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the PCB layout allows for good airflow around the device.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered. Additionally, consider using a thermally conductive heat sink or a heat spreader to dissipate heat efficiently.
  • For EMI and RFI shielding, it is essential to use a metal shield or a Faraday cage around the device. Ensure that the shield is properly grounded and that there are no gaps or openings in the shield. Additionally, use EMI-absorbing materials and consider using a shielded cable or a coaxial cable for connections.
  • To troubleshoot issues related to output voltage regulation, first, verify that the input voltage is within the recommended range. Check the output voltage using a multimeter and ensure that it is within the specified tolerance. If the output voltage is not within the specified range, check the feedback resistors, the output capacitor, and the input capacitor for any signs of damage or wear.
  • To prevent damage, store the TC72-3.3MUATR in its original packaging or in a dry, cool place away from direct sunlight. Avoid exposing the device to moisture, extreme temperatures, or physical stress. Handle the device by the body, avoiding touching the pins or electrical connections.

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TC72-3.3MUATR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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