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TC75W51FU - Toshiba

Description: Dual Op-amp (CMOS), 7 V, +/-3.5 V, SOT-505(SM8)

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PCB Footprints
TC75W51FU - Toshiba PCB footprint - Other - Other - SSOP8-P-0.65
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3D Models
TC75W51FU - Toshiba  - 3D model - Other - SSOP8-P-0.65
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TC75W51FU Details

  • Manufacturer Part Number:

    TC75W51FU

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    65 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP8,.16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.3 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.4 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    600

  • Voltage Gain-Min:

    1000

  • Wideband:

    NO

  • Width:

    2.8 mm

TC75W51FU Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to derate the device's power consumption according to the temperature derating curve provided in the datasheet.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the device.
  • Yes, the TC75W51FU can be used in switching regulator applications, but it's essential to ensure that the device is properly bypassed and decoupled to prevent noise and oscillations. Additionally, the device's power consumption should be derated according to the switching frequency and duty cycle.
  • To troubleshoot issues with the device's output voltage, check the input voltage, output load, and PCB layout for any signs of noise or oscillations. Verify that the device is properly decoupled and bypassed, and that the output capacitor is of sufficient value and type.

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TC75W51FU Overview

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