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TC7650CPD - Microchip

Description: TC7650CPD Microchip, Chopper Stabilized, Op Amp, 2MHz, 14-Pin PDIP

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TC7650CPD - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - TC7650CPD
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TC7650CPD Details

  • Manufacturer Part Number:

    TC7650CPD

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    PLASTIC, DIP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    PDIP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CHOPPER-STAB

  • Average Bias Current-Max (IIB):

    0.0004 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    120 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5 µV

  • JESD-30 Code:

    R-PDIP-T14

  • JESD-609 Code:

    e3

  • Length:

    19.24 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -9 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Nom:

    2.5 V/us

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage Limit-Max:

    9 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    7.62 mm

TC7650CPD Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital sections separate. Use short, direct traces for the power supply and output, and avoid routing signals under the IC. Refer to the Microchip application note AN954 for more details.
  • The TC7650CPD requires a single 5V power supply. Ensure the power supply is stable and well-regulated. Power sequencing is not critical, but it's recommended to power up the device after the input voltage is stable. A 10uF decoupling capacitor is recommended between VCC and GND.
  • The maximum output current of the TC7650CPD is 100mA. To limit the output current, use a current-limiting resistor in series with the output pin. The value of the resistor depends on the desired current limit and the output voltage.
  • The TC7650CPD output voltage is set using the R1 and R2 resistors. Use the formula in the datasheet to calculate the resistor values for the desired output voltage. The output voltage range is 1.25V to 5V, and the minimum output voltage is limited by the input voltage and the dropout voltage.
  • The TC7650CPD has a thermal shutdown feature that activates at 150°C. Ensure good airflow around the device, and use a heat sink if necessary. The thermal resistance (θJA) is 30°C/W. Follow the thermal management guidelines in the datasheet and application notes.

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TC7650CPD Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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