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TC7MPB9307FK(EL) - Toshiba

Description: Toshiba TC7MPB9307FK(EL), Bus Switch, 8 x 1:1, 1.65 → 5 V, 2.3 → 5.5 V, 20-Pin VSSOP

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TC7MPB9307FK(EL) - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - VSSOP20-P-0030-0.50
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TC7MPB9307FK(EL) - Toshiba  - 3D model - Small Outline Packages - VSSOP20-P-0030-0.50
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TC7MPB9307FK(EL) Details

  • Manufacturer Part Number:

    TC7MPB9307FK(EL)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VSSOP-20

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES FROM 2.3 TO 5.5 VOLT SUPPLY

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    P

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    5 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    BUS DRIVER

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.16,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Supply Current-Max (ICC):

    25 mA

  • Prop. Delay@Nom-Sup:

    2.2 ns

  • Propagation Delay (tpd):

    2.2 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3 mm

TC7MPB9307FK(EL) Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a solid ground plane, short traces, and minimal vias to reduce noise and parasitic inductance. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended temperature range (−40°C to +125°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer.
  • The TC7MPB9307FK(EL) has built-in ESD protection diodes, but additional external protection measures are recommended. Use ESD-sensitive handling procedures, and consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to the PCB design.
  • Yes, the TC7MPB9307FK(EL) is suitable for high-reliability and automotive applications. However, ensure that the device is operated within the recommended temperature range and that the PCB design meets the required reliability and safety standards.
  • Toshiba recommends soldering the device using a reflow soldering process with a peak temperature of 260°C (±5°C) and a dwell time of 30 seconds (±10 seconds). Ensure that the soldering process meets the IPC-J-STD-020 standard.

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TC7MPB9307FK(EL) Overview

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