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TC7WZ14FK,LJ(CT - Toshiba

Description: Logic IC, Schmitt Trigger Inverter, Triple, 1 Inputs, 8 Pins, SOT-765

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TC7WZ14FK,LJ(CT Details

  • Manufacturer Part Number:

    TC7WZ14FK,LJ(CT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-8

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    INVERTER

  • Max I(ol):

    0.032 A

  • Number of Functions:

    3

  • Number of Inputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    7.5 ns

  • Propagation Delay (tpd):

    17.5 ns

  • Schmitt Trigger:

    YES

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

TC7WZ14FK,LJ(CT Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the TC7WZ14FK,LJ(CT is 2.3V to 5.5V, as specified in the datasheet.
  • To ensure proper power-on and power-off, follow the recommended power-up and power-down sequences outlined in the datasheet, and make sure to meet the specified voltage and current requirements.
  • The maximum allowable power dissipation for the TC7WZ14FK,LJ(CT is 150mW, as specified in the datasheet. Exceeding this limit may cause the device to overheat or fail.
  • To prevent electrostatic discharge (ESD) damage, follow proper handling and storage procedures, such as using anti-static wrist straps, mats, and packaging materials. Additionally, ensure that the device is properly grounded during assembly and testing.
  • Follow the recommended PCB layout and thermal management guidelines outlined in the datasheet and application notes to ensure proper heat dissipation and minimize thermal resistance.

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TC7WZ14FK,LJ(CT Overview

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