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TCB501HQ - Toshiba

Description: Toshiba

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Symbol
TCB501HQ - Toshiba - PCB symbol
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PCB Footprints
TCB501HQ - Toshiba PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - HZIP25-P-1.00F-1
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3D Models
TCB501HQ - Toshiba - 3D model - Transistor Outline, Vertical - HZIP25-P-1.00F-1
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TCB501HQ Details

  • Manufacturer Part Number:

    TCB501HQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HZIP-25

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Harmonic Distortion:

    0.006%

  • JESD-30 Code:

    R-PZIP-T25

  • Length:

    28.8 mm

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    80 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HZIP

  • Package Equivalence Code:

    ZIP25,.16,.16,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE, HEAT SINK/SLUG

  • Seated Height-Max:

    19.37 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    NO

  • Technology:

    CDMOS

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    ZIG-ZAG

  • Width:

    4.5 mm

TCB501HQ Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to derate the device's power dissipation according to the ambient temperature. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation.
  • Although the datasheet doesn't specify a maximum allowed voltage on the input pins, it's generally recommended to limit the input voltage to 5.5V to prevent damage to the internal ESD protection diodes.
  • Yes, the TCB501HQ can be used in switching regulator applications, but it's essential to ensure that the device is properly bypassed and decoupled to prevent voltage spikes and ringing. Additionally, consider the device's power dissipation and thermal performance in the switching regulator design.
  • To prevent ESD damage during handling and assembly, follow proper ESD handling procedures, such as using an ESD wrist strap, mat, or workstation, and ensure that all equipment and tools are properly grounded. Additionally, consider using ESD-protective packaging and storage materials.

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TCB501HQ Overview

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